Xintec Inc. (3374.TWO) Income Statement Analysis – Financial Results

About Xintec Inc.

Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company offers wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. It also provides optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and wafer reconstruction with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Its products are used in tablets, notebooks, computers, and medical applications. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.